Ⅰ．学術論文(査読付きFull Paper)
1. 感圧導伝ゴムを応用した側弯症装具矯正効果判定の試み，整形外科バイオメカニクス，12 (1990)，215-217，新井久夫・古賀良生・高橋一雄・原利昭・笹川和彦・中部昇・茂野勇一
2. 膝蓋大腿関節の接触圧力分布－膝関節運動及び脛骨結節浮上術に関連して－，整形外科バイオメカニクス，12 (1990)，225-228，笹川和彦・中部昇・原利昭・古賀良生・大森豪
3. 人工膝関節置換後の膝蓋骨脱臼についての検討，整形外科バイオメカニクス，12 (1990)，255-258，中部昇・笹川和彦・原利昭・古賀良生・大森豪
4. 人工膝関節置換術後の膝蓋大腿関節におけるpatella trackingと接触圧力についての実験的検討，整形外科バイオメカニクス，13 (1991)，387-391，大森 豪・古賀良生・高橋栄明・笹川和彦・原利昭・Joan E. Bechtold・Ramon B. Gustilo
5. ＰＴＢ下腿装具の免荷性の評価，日本機械学会論文集（Ａ編），58 (1992)，1148-1153，笹川和彦・原利昭・石井卓・古賀良生・金谷喜久雄・田村義則
6. 感圧導電ゴムを用いた関節内接触圧力分布測定システム，日本機械学会論文集（Ａ編），58 (1992)，1154-1159，原利昭・笹川和彦・中部昇・古賀良生・金谷喜久雄
7. 股関節接触面圧の実験的解析－感圧導電ゴムセンサーを使用して－，日本臨床バイオメカニクス学会，14 (1992)，315-318，元田英一・三浦隆行・岩崎洋史・笹川和彦・原利昭
8. 膝蓋大腿関節の接触圧力分布および膝蓋骨trackingの同時測定システム，日本臨床バイオメカニクス学会，14 (1992)，319-323，今井和実・笹川和彦・原利昭・大森豪・高橋美徳・古賀良生
9. 膝蓋骨非置換人工膝関節置換術後の膝蓋大腿関節における接触動態についての実験的検討，日本臨床バイオメカニクス学会，14 (1992)，325-329，大森豪・古賀良生・笹川和彦・原利昭・今井和実・Joan E. Bechtold・Ramon Gustilo
10. 脛骨結節前方移行術前後の膝蓋大腿関節の接触圧力および膝蓋骨trackingの変化，日本臨床バイオメカニクス学会，14 (1992)，331-334，笹川和彦・今井和実・原利昭・大森豪・高橋美徳・古賀良生
11. 下肢アライメント変化による膝関節接触圧力への影響についての実験的検討，日本臨床バイオメカニクス学会，14 (1992)，341-344，岩崎洋史・笹川和彦・原利昭・大森 豪・高橋美徳・古賀良生
12. 駆血帯装着時の接触圧力分布測定，日本臨床バイオメカニクス学会，14 (1992)，453-456，船平伸之・笹川和彦・原利昭・佐藤朗・古賀良生
13. 膝蓋骨非置換ＴＫＡにおける膝蓋大腿関節の適合性についての検討，日本臨床バイオメカニクス学会誌，15 (1994)，483-488，中部昇・今井和実・原利昭・笹川和彦・大森豪・古賀良生
14. THEORETICAL ANALYSIS OF ELECTROTHERMAL CRACK PROBLEM CONSIDERING THOMSON EFFECT, Mechanics and Materials for Electronic Packaging: Volume 3 - Coupled Field Behavior in Materials, 1994 International Mechanical Engineering Congress and Exposition, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, AMD-193 (1994)，53-59, Masumi Saka, Kazuhiko Sasagawa, and Hiroyuki Abé
15. CURRENT DENSITY AND TEMPERATURE DISTRIBUTIONS NEAR THE CORNER OF ANGLED METAL LINE, Mechanics Research Communications, 22(5) (1995), 473-483, K. Sasagawa, M. Saka and H. Abé
16. THEORETICAL ANALYSIS OF A CRACK PROBLEM IN ELECTROTHERMAL FIELD, Application of Fracture Mechanics in Electronic Packaging and Materials, THE 1995 ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION，THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-11/MD-64 (1995), 1-6, Kazuhiko Sasagawa, Masumi Saka and Hiroyuki Abé
17. Analysis of Electromigration in Angled Metal Line, Experimental/Numerical Mechanics in Electronic Packaging, SEM, 1 (1996), 108-116, K. Sasagawa, Y. Honma, M. Saka and H. Abé
18. Contact pressure and three-dimensional tracking of unresurfaced patella in total knee arthroplasty, The Knee, 4 (1997), 15-21, Go Omori, Yoshio Koga, Joan E. Bechtold, Ramon B. Gustilo, Noboru Nakabe, Kazuhiko Sasagawa, Toshiaki Hara, Hideaki E. Takahashi
19. EFFECT OF ROUNDNESS GIVEN TO CORNER OF ANGLED METAL LINE ON ELECTROMIGRATION FAILURE, Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK ’97, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-19-1 (1997), 1177-1182, Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka and Hiroyuki Abé
20. Study on Electromigration Considering Singularity of Temperature Gradient at Corner, Experimental/Numerical Mechanics in Electronic Packaging, SEM, 2 (1997), 126-133, Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka and Hiroyuki Abé
21. Analysis of Electromigration Considering Thomson Effect, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, THE 1998 ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION，THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-24 (1998), 87-92, K. Sasagawa, M. Yagi, M. Saka and H. Abé
22. A New Approach to Calculate Atomic Flux Divergence by Electromigration, Transactions of the ASME, Journal of Electronic Packaging, 120(1998), 360-366, K. Sasagawa N. Nakamura M. Saka H. Abé
23. 金属薄膜配線におけるエレクトロマイグレーション損傷支配パラメータの実験的検証，日本機械学会論文集(Ａ編)，65 (631), (1999-3), 469-476，笹川和彦, 中村直章, 坂真澄, 阿部博之
24. Verification of a Governing Parameter for Electromigration Damage in Bamboo Lines, Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK ’99, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-16-1 (1999), 227-232, Kazuhiko Sasagawa, Kazushi Naito, Masataka Hasegawa, Masumi Saka and Hiroyuki Abé
25. Prediction of Electromigration Failure in Bamboo Lines, Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK ’99, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-16-1 (1999), 233 - 238, Kazuhiko Sasagawa, Kazushi Naito, Masumi Saka and Hiroyuki Abé
26. A Method to Predict Electromigration Failure of Metal Lines [Journal of Applied Physics, 86 (11), (1999-12), 6043 - 6051] K. Sasagawa, K. Naito, M. Saka and H. Abé
27. Atomic Flux Divergence in Bamboo Line for Predicting Initial Formation of Voids and Hillocks [Theoretical and Applied Fracture Mechanics, 33 (1), (2000-2), 67 - 72] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
28. Experimental Verification of Prediction Method for Electromigration Failure of Polycrystalline Lines [Journal of Applied Physics, 87 (6), (2000-3-15), 2785 - 2791] K. Sasagawa, K. Naito, H. Kimura, M. Saka and H. Abé
29. Verification of the Governing Parameter for Electromigration Damage in Passivated Polycrystalline Line [Proc. of InterPACK '01, The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, ASME, Kauai, Hawaii, USA, July 8-13, 2001, (2001-7-9), IPACK2001-15644, 1-9] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
30. Effects of Corner Position and Operating Condition on Electromigration Failure in Angled Bamboo Lines without Passivation Layer [Thin Solid Films, 401(1-2), (2001-12-17), 255 - 266] K. Sasagawa, M. Hasegawa, K. Naito, M. Saka and H. Abé
31. Governing Parameter for Electromigration Damage in the Polycrystalline Line Covered with Passivation Layer [Journal of Applied Physics, 91(4), (2002-2-15), 1882-1890] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
32. Prediction of Electromigration Failure in Passivated Polycrystalline Line [Journal of Applied Physics, 91(11), (2002-6-1), 9005-9014] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
33. Simulation of Electromigration Failure in Angled Polycrystalline Line Covered with Passivation Layer [Advances in Computational Engineering & Sciences, Proc. 2002 International Conference for Computational Engineering and Sciences(CD-ROM), (2002-7/31-8/2, Reno), paper-ID 86] M. Hasegawa, K. Sasagawa, M. Saka and H. Abé
34. Derivation of Film Characteristics and Prediction of Electromigration Failure in Passivated Polycrystalline Line [Advanced Metallization Conference 2002, (2002-10/28-30), MRS, 291-296] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
35. Failure Simulation of Angled Polycrystalline Lines Covered with Passivation Layer [Proc. 2002 ASME International Mechanical Engineering Congress & Exposition (CD-ROM), ASME, Nov. 17-22, 2002, New Orleans, USA, paper-ID IMECE2002-39677] M. Hasegawa, K. Sasagawa, M. Saka and H. Abé
36. Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends [Proc. of InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, July 6-11, 2003, (2003-7-6), InterPack2003-35064] M. Hasegawa, K. Sasagawa, M. Saka and H. Abé
37. Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness [Proc. of InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, July 6-11, 2003, (2003-7-6), InterPack2003-35065] K. Sasagawa, M. Hasegawa, N. Yoshida, M. Saka and H. Abé
38. Derivation of Film Characteristic Constants by Using Governing Parameter for Electromigration Damage in Passivated Bamboo Line [Proceedings of 11th International Conference on Fracture (CD-ROM), March 20-25, 2005, Turin, Italy, Paper ID 3699] M. Hasegawa, K. Sasagawa and M. Saka
39. Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines [Proceedings of IPACK2005(CD-ROM), The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, ASME, July 17-22, 2005, San Francisco, California, USA, Paper ID IPACK2005-73133] K. Sasagawa, S. Uno, N. Yamaji and M. Saka
40. Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line [Key Engineering Materials, Vol. 297-300(Advances in Fracture and Strength), Proc. Asian Pacific Conference for Fracture and Strength ’04, Lotte Hotel Jeju, Korea (2004-10/6-8), Nov. 2005, 263-268] S. Uno, M. Hasegawa, K. Sasagawa and M. Saka
41. Electromigration Failure of Metal Lines [International Journal of Fracture, Volume 138, Numbers 1-4, March 2006, 219-240] H. Abé, K. Sasagawa and M. Saka
42. Evaluation of Threshold Current Density of Electromigration Damage in Angled Bamboo Lines [Proceedings of ASME 2007 InterPACK Conference(CD-ROM), The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, ASME, July 8-12, 2007, Vancouver, British Columbia, CANADA, Paper ID IPACK2007-33237] K. Sasagawa and S. Fukushi
43. 高位脛骨骨切り術前後における膝蓋大腿関節の接触圧力分布測定 [日本臨床バイオメカニクス学会誌, Vol.28 (2007/11/20), 173-177] 成田純平，笹川和彦，塚田晴彦，石橋恭之
44. リンパ浮腫治療用弾性ストッキングと下肢間の接触圧力分布測定システム[日本臨床バイオメカニクス学会誌, Vol.28 (2007/11/20), 433-437] 矢島久幸，笹川和彦，細川賀乃子，近藤和泉
45. Threshold Current Density of Electromigration Damage in Angled Polycrystalline Line [Key Engineering Materials Vols. 353-358 (2007, Nov.) pp. 2958-2961] K. Sasagawa, N. Yamaji and S. Fukushi
46. Formation of Metallic Micro/Nanomaterials by Utilizing Migration Phenomena and Techniques for Their Applications [Materials Science Forum, Vol. 614, (Mar., 2009), 3-9] M. Saka, H. Tohmyoh, M. Muraoka, Y. Ju, and K. Sasagawa
47. Derivation of Electromigration Characteristic Constants of Metal Line Used in Electronic Devices [Proc. 12th Int. Conf. Fracture, July 12-17, 2009, Ottawa, Canada (CD-ROM), (July, 2009), Paper No. T22.009. (total 9 pages)] K. Sasagawa, T. Gomyo, and A. Kirita
48. Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree [Proc. ASME 2009 InterPACK Conf., July 19-23, 2009, San Francisco, California, USA (CD-ROM), (2009), Paper No. IPACK2009-89229 (total 6 pages)] K. Sasagawa, A. Kirita, T. Abo, and A.H. Hassan
49. 嚥下時の口腔および咽頭内の接触圧力同時測定システムの開発, 臨床バイオメカニクス, Vol.30, （２００９年９月２０日），83-87] 大里泰彦，笹川和彦，横山紘太郎，才藤栄一，近藤和泉
50. ステント形状評価を目的とした血管―ステント間の接触圧力分布測定システム, 臨床バイオメカニクス, Vol.30, （２００９年９月２０日），249-253] 笹川和彦，横山紘太郎，成田純平
51. Derivation of Film Characteristic Constants of Polycrystalline Line for Reliability Evaluation against Electromigration Failure [Mechanics of Materials, 41(10) , (Oct., 2009), 1090-1095] M. Hasegawa, K. Sasagawa, S. Uno, M. Saka and H. Abé
52. A Numerical Simulation of Nanostructure Formation Utilizing Electromigration [J. Electron. Mater., 38(10), (Nov., 2009), 2201-2206] K. Sasagawa, S. Fukushi, Y. Sun, and M. Saka
53. Simulation of Nanostructure Production by Electromigration Considering Specimen's Shape [J. Nanosci. Nanotechnol., 10(9), (2010-9), 6036-6040] K. Sasagawa, A. Kirita, S. Fukushi and M. Saka
54. Development of Sensor System for Measurement of Distributions of Contact Pressure and Shear Stress on Contacting Skin Surface [The 5th International Symposium on Advance and Technology in Experimental Mechanics(CD-ROM), Kyoto/Ryukoku University, (2010-11/4~7), Paper ID: 127] K. Sasagawa, K. Tokiyoshi
55. Development of Simulation of Nanostructure Production due to Electromigration Considering Specimen’s Damage [Proc. the 4th JSME/ASME International Conference on Materials and Processing(CD-ROM), Corvallis, Oregon, USA, (2011-6/13~17), Papar ID: ICMP2011-51113] K.Sasagawa, T. Abo and J. Unuma
56. Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes under High Current Density [Proc. ASME 2011 InterPACK Conf.(CD-ROM), Portland, Oregon, USA, (2011-7/6~8), Paper ID: InterPACK2011-52169] K.Sasagawa, J. Unuma and T. Abo
57. 内視鏡手術への応用を目的とした高空間分解能接触圧力センサシステムの開発 [臨床バイオメカニクス, Vol.32, (2011-10/25), 185-190] 笹川和彦, 石川諒, 横山紘太郎, 大里泰彦
58. 生体への適用を目的とした接触圧力およびせん断応力の同時測定センサの開発 [臨床バイオメカニクス, Vol.32, (2011-10/25), 309-313] 時吉康太, 笹川和彦
59. A Comparison of Electromigration Failure of Metal Lines with Fracture Mechanics [Acta Mech. Sin. 28(3), (2012-8):774–781] H. Abé, M. Muraoka, K. Sasagawa and M. Saka
60. Numerical Modeling of Electromigration Damage in Multilevel Interconnection with Reservoir Structure for Evaluation of Allowable Electric Current [Proceedings of the 7th International Symposium on Advanced Science and Technology in Experimental Mechanics, Taipei/The Grand Hotel, Taiwan, (2012-11/8-11), Paper ID: G101] K. Sasagawa, T. Yanagi and J. Unuma
61. Numerical Study of Allowable Current Density for Electromigration Damage of Multilevel Interconnection in Integrated Circuit [Proceedings of 13th International Conference on Fracture (CD-ROM), Paper ID: S30-008, 8 pages, (2013/6/19, China National Convention Center, Beijing, China)] K. Sasagawa, K. Fujisaki, T. Yanagi
62. Novel motion preservation device for atlantoaxial instability [J. Spinal Disorders & Techniques, 26(3), (May 2013), pp. E107-111] Kato, Kozo; Yokoyama, Toru; Ono, Atsushi; Numasawa, Takuya; Wada, Kanichiro; Tonosaki, Yoshikazu; Osato, Yasuhiko; Sasagawa, Kazuhiko; Toh, Satoshi
63. Development of Contact-Pressure and Shear-Stress Sensing System for Application to a Haptic Display [J. JSEM, Vol.13, (July 2013), pp. s228-s232, 2013] K. Sasagawa, T. Oyama, K. Tokiyoshi, K. Yokoyama
64. 人工股関節置換術におけるカップ固定性評価を目指した接触圧力分布測定システムの開発 [臨床バイオメカニクス, Vol.34, (Nov. 2013), pp.129-134] 塚原 智, 笹川和彦, 西井 孝
65. Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices under High Current Density [ASME J. Electronic Packaging, Vol. 136, No. 4,Dec. 2014, 041011-1-5] K. Sasagawa, K. Fujisaki, J. Unuma, R. Azuma
66. ラットアキレス腱の引張試験による弾性率評価 [臨床バイオメカニクス, Vol. 35, pp. 303-307, (2014)] 小山拓馬, 藤崎和弘, 笹川和彦, 飯尾浩平, 津田英一, 山本祐司, 石橋恭之
67. Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure with Reservoir [Proceedings of ASME InterPACKICNMM2015, Paper No. IPACK2015-48744, V002T02A015; 5 pages，doi:10.1115/IPACK2015-48744，20150706-9, San Francisco, USA] K. Fujisaki, H. Narita, K. Sasagawa
68. Evaluation of (Bi0.4Sr0.6)xCo0.3Fe0.7O3−δ (x = 0.7, 0.8, 0.9, 1.0, 1.1) perovskite-type oxide as potential cathode for intermediate-temperature solid oxide fuel cells [International Journal of Hydrogen Energy, Volume 40, Issue 34, 14 September 2015, Pages 11011–11021, doi:10.1016/j.ijhydene.2015.05.195] Deni S. Khaerudini, Guoqing Guan, Peng Zhanga, Xiaogang Hao, Zhongde Wang, Yutaka Kasai, Kazuhiko Sasagawa, Abuliti Abudula
69. Development of Thin and Flexible Sensor System for Stress Evaluation of Contact Interface［2016 Design of Medical Devices Conference, Minneapolis, Minnesota, 20160413, ASME Journal of Medical Devices, 2pages］K. Fujisaki, S. Ogawa, R. Kasai, K. Sasagawa
70. Damage of Single-Wall Carbon Nanotube Network Structure under Electric Current Loading [JSME Mechanical Engineering Journal, Vol. 3 (2016), No. 3, Paper NO. 16-00292 (8 pages)] Syunsuke SATO, Kazuhiro FUJISAKI, Kazuhiko SASAGAWA
71. Development of Thin and Flexible Contact Pressure Sensing System for High Spatial Resolution Measurements [Sensors and Actuators A: Physical, 20170815, Vol.263, pp.610-613] Kazuhiko Sasagawa, Junpei Narita
72. Demineralization of cortical bone for improvement of Charpy impact fracture characteristics [Journal of Biomechanical Science and Engineering, 12(3), 2017, 16-00267] Kazuhiro FUJISAKI, Ayumi HASEGAWA, Hiroya YOKOYAMA, Kazuhiko SASAGAWA
73. Relationship between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line [ InterPACK 2017(ASME),San Francisco, USA, 20170830, Proceedings of InterPACK 2017, Paper No. IPACK2017-74092 ] Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
74. Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-shaped Metal Line [ InterPACK 2017(ASME),San Francisco, USA, 20170830, Proceedings of InterPACK 2017, Paper No. IPACK2017-74509] Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
75. 採血手技の運動および力覚の計測 [臨床バイオメカニクス、20171002、Vol.38(2017)、pp.393-398]其田雅人、笹川和彦、藤崎和弘、森脇健司、萱場広之
76. Effect of Voltage-induced Apatite Deposition Process on Mechanical Properties of Demineralized Bone Tissue [ The 12th International Symposium in Advanced Science and Technology in Experimental Mechanics (ISEM), Kanazawa, Japan, 20171104, Proceedings of ISEM2017, Paper No.084] Naoya Saito, Kazuhiro Fujisaki, Takeshi Moriwaki, Kazuhiko Sasagawa
77. Development of Tube-type Pressure Distribution Sensor for Performance Evaluation of Endovascular Device [ The 12th International Symposium in Advanced Science and Technology in Experimental Mechanics (ISEM), Kanazawa, Japan, 20171104, Proceedings of ISEM2017, Paper No.085] Takeshi Moriwaki, Asuka Saito, Kazuhiko Sasagawa, Kazuhiro Fujisaki
78. Evaluation of Mechanical Properties of Microscopic Structure of Aortic Tissue by Means of Peeling Tests [ The 12th International Symposium in Advanced Science and Technology in Experimental Mechanics (ISEM), Kanazawa, Japan, 20171104, Proceedings of ISEM2017, Paper No.090] Shohei Nakargawa, Kazuhiro Fujisaki, Takeshi Moriwaki, Kazuhiko Sasagawa
79. Observation of Apatite Formation on Titanium Plate and Bone Surfaces in Electric Stimulation [International journal of automation technology, 11(6), (2017), 902-906] Fujisaki Kazuhiro, Saito Naoya, Date Shunto, Sasagawa Kazuhiko
80. Observation of Balloon Dilatation Pressure Distribution by using a Flexible Thin Film Sensor [Advanced Experimental Mechanics, 3(2018), 187-191] Takeshi MORIWAKI, Kazuhiro FUJISAKI, Kazuhiko SASAGAWA
81. Development of Contact Pressure and Shear Stresses Sensor for Touch Panel [JSME Mechanical Engineering Letters, 4(2018), Paper No.18-00257[DOI: 10.1299/mel.18-00257]] R. Kasai, K. Sasagawa, K. Fujisaki, S. Saito, H. Koyama
82. Adhesion Force Measurement with a Flexible Film-type Sensor [Advanced Experimental Mechanics, 4(2018), 153-156] Takeshi MORIWAKI, Kazuhiro FUJISAKI, Kazuhiko SASAGAWA
83. Anode-Side Failure of a Cuprous Oxide Semiconductor Caused by High-Density Current Loading [Journal of Electronic Materials, 48(2019), pages 6949–6953] Takeshi Moriwaki, Kazuhiko Sasagawa, Yusuke Sugawara, Kazuhiro Fujisaki, Takahiro Mineta
84. Damage of Flexible Electronic Line Printed with Ag Nanoparticle Ink Due To High-Current Density [Proc. ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2019), InterPACK 2019-6408] Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
85. Electromigration Damage of Flexible Electronic Lines Printed with Ag Nanoparticle Ink [ASME Journal of Electronic Packaging, 14(2),(2020), 031107.1-5] Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
86. Evaluation of Venipuncture Techniques based on Measurements of Haptic Sense and Finger Motion [Advanced Biomedical Engineering, 9(2020), 197-201] Masato SONODA, Kazuhiko SASAGAWA, Kazuhiro FUJISAKI, Takeshi MORIWAKI, Hiroyuki KAYABA
87. Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation [Microelectronics Reliability, 118(2021), 114060-1-6] Ryuji Takaya, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
88. Development of compact pressing system for muscle activity evaluation in force myography [Mechanical Engineering Letters, 7(2021), 21-00283] Kazuhiro FUJISAKI, Ayane KONDO, Kazuhiko SASAGAWA, Takeshi MORIWAKI
89. 薄型力覚センサを利用した穿刺支援システムの開発 [臨床バイオメカニクス, 42(2021), 9-13] 瀬田雄元, 笹川和彦, 藤崎和弘, 森脇健司
90. Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading [Proceedings of ASME InterPACK2021, (2021), 68902.1-4] Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
91. Strain analysis of fruit tree branch under large deflection considering flexural deformation characteristics [Journal of Biomechanical Science and Engineering, 17(1), (2022), 21-00092] Kenta ISHII, Kazuhiro FUJISAKI, Kazuhiko SASAGAWA, Takeshi MORIWAKI
92. Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current [ASME Journal of Electronic Packaging, 144(4), (2022), 041012.1-6] Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
93. Demineralization characteristics of cortical bone under voltage application in phosphate-buffered saline [Journal of Biomechanical Science and Engineering, 17(2), (2022), 21-00293] OSANAI Keita, FUJISAKI Kazuhiro, OTA Fuki, SASAGAWA Kazuhiko, MORIWAKI Takeshi
94. Experimental evaluation of threshold current density for electromigration damage in Al interconnect line with reservoir and sink structure [Mechanical Engineering Letters, 8(2022), 22-00035] MORIWAKI Takeshi, TAKAYA Ryuji, SASAGAWA Kazuhiko, FUJISAKI Kazuhiro
95. A novel method for coating calcium phosphate with trace elements extracted from bone using electrical stimulation [Journal of the mechanical behavior of biomedical materials, 133(2022), 105330-1-7] Fuki Ota, Kazuhiro Fujisaki, Keita Osanai, Kazuhiko Sasagawa
96. Measurement of contact stress between clothing and skin using thin and flexible triaxial stress sensor [Journal of Biomechanical Science and Engineering, 17(4), (2022), 22-00149] KAMATA Ryuto, SASAGAWA Kazuhiko, FUJISAKI Kazuhiro
97. 薄型３軸応力センサを用いた介護用ベッド臥床時の褥瘡好発部位における接触応力の計測 [臨床バイオメカニクス, 43(2022), 319-326] 工藤雄行, 笹川和彦, 藤崎和弘
98. Film sensor for triaxial contact stress measurements on the human body [Mechanical Engineering Letters, 9(2023), 22-00309] KUDO Yuko, SASAGAWA Kazuhiko, FUJISAKI Kazuhiro
99. 褥瘡発生メカニズム調査のための接触応力値を境界条件とした有限要素解析手法の検討 [臨床バイオメカニクス, 44(2023), 303-308] 小野綾, 笹川和彦, 藤崎和弘, 三浦鴻太郎
100. 介護用ベッド背もたれ操作時の仙骨部接触応力変化に対する膝上げ機能の影響 [臨床バイオメカニクス, 44(2023), 309-317] 工藤雄行、笹川和彦、藤﨑和弘
101. フィルムセンサを用いた傾斜路歩行時の足底に作用する接触圧力とせん断応力の計測 [臨床バイオメカニクス, 44(2023), 159-162] 木村緋、笹川和彦、藤崎和弘
102. Effect of insulating layer on damage of flexible Ag nanoparticle line under high-density electric current [JSME Mechanical Engineering Journal, 11(6), (2024), 24-00127] Taiga KUDO, Kazuhiko SASAGAWA, Kazuhiro FUJISAKI, Kotaro MIURA
103. サッカー関連動作中の足底に作用する 接触圧力・せん断応力の分布計測 [臨床バイオメカニクス, 45(2024), 207-214] 木村緋、笹川和彦、藤崎和弘、三浦鴻太郎、大森豪
104. Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current [Proc. ASME InterPACK 2024, (2024), IPACK2024-141181] Kazuki Hisasue, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Kotaro Miura, Yusuke Souma
105. Topology Optimization of Electronic Line Using Computer Aided Engineering Software [Proc. ASME InterPACK 2024, (2024), IPACK2024-139338] Kotaro Miura, Hiromu Kudo, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Ⅱ．総説・解説・記事
1. 圧力センサーを使用した側弯矯正装具のチェックシステム，日本義肢装具学会誌，8 (1992), 35-37，田村義則・赤川喜一・古賀良生・新井久夫・高橋一雄・原利昭・笹川和彦・中部昇
2. 感圧導電ゴムセンサとその応用－下腿装具の機能評価－，センサ技術，12 (1992)，62-67，原利昭・笹川和彦・古賀良生
3. ＬＳＩ断線シミュレーション 弘前大がソフト開発，日刊工業新聞，5月21日(1999)，7
4. Software for Simulation of Line Failure of LSI Devices，New Technology Japan，JETRO，27(6)，1999-9，33
5. 半導体の損傷予測ソフト開発，東奥日報，11月20日(2001)，16
6. エレクトロマイグレーション，日本実験力学会誌「実験力学」,3(4), (2003-12)，71-72，笹川和彦
7. 米機械学会で最優秀 半導体の損傷・寿命を予測，東奥日報，9月20日(2007)，夕刊3
8. 生体に作用する応力計測, 非破壊検査, Vol.62, pp. 515-521, 2013.10， 笹川和彦, 藤﨑和弘
9. ロボ、正確に自動採血，日経産業新聞，10月10日(2018), 7
10. 生体医工学シンポジウム2020について, 生体医工学, 58(6), (2020), 248-251
11. 生体計測（３．５節 ３章バイオメカニクス）, 機械工学年鑑2020-機械工学の最新動向-, (2020)
12. 薄型接触応力センサの開発と生体応用, 非破壊検査, (2021,4), 笹川和彦, 藤崎和弘
13. 薄くしなやかで皮膚にも貼れる力覚（圧力とせん断）センサ, クリーンテクノロジー, (2024,10), 笹川和彦，藤崎和弘，三浦鴻太郎
14. 薄くしなやかで皮膚にも貼れる力覚計測用の3軸応力センサ, バイオインダストリー, (2024,12), 笹川和彦，藤崎和弘，三浦鴻太郎
Ⅲ．著書
1. 機械工学便覧 [基礎編α３材料力学(2005-4-25)，分担執筆１３・１４，199 – 200，日本機械学会，丸善] 笹川和彦ほか （全８６名）
2. よくわかる実験技術・学術用語 [分担執筆 よくわかる学術用語 エレクトロマイグレーション，ISBN4-9903400-0-0, 91 – 92，横山 隆，松井剛一，井口 学編集，日本実験力学会，全123頁(2006-11-1)] 笹川和彦ほか （全３５名）
3. 金属微細配線におけるマイグレーションのメカニズムと対策 [分担執筆 第１２章エレクトロマイグレーションの損傷予測モデリング，ISBN4-903413-15-2, 151 – 174，新宮原 正三 監修，サイエンス＆テクノロジー，全206頁(2006-12-25)] 笹川和彦ほか （全１５名）
4. Metallic Micro and Nano Materials - Fabrication with Atomic Diffusion [Engineering Materials, M. Saka (Ed.), Springer, (2011) , ISBN978-3-642-15410-2] M. Saka, K. Sasagawa, M. Muraoka, H. Tohmyoh and Y. Ju (Authors)
5. 金属ナノ粒子、微粒子の合成、調整と最新応用技術[分担執筆 高密度電流下におけるフレキシブル金属ナノ粒子配線の損傷, 技術情報協会(2021, 10)] 笹川和彦, 藤﨑和弘、ほか
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