研究業績


T.学術論文(査読付きFull Paper)

1.    感圧導伝ゴムを応用した側弯症装具矯正効果判定の試み,整形外科バイオメカニクス,12 (1990)215-217,新井久夫・古賀良生・高橋一雄・原利昭・笹川和彦・中部昇・茂野勇一

2.    膝蓋大腿関節の接触圧力分布−膝関節運動及び脛骨結節浮上術に関連して−,整形外科バイオメカニクス,12 (1990)225-228笹川和彦・中部昇・原利昭・古賀良生・大森豪

3.    人工膝関節置換後の膝蓋骨脱臼についての検討,整形外科バイオメカニクス,12 (1990)255-258,中部昇・笹川和彦・原利昭・古賀良生・大森豪

4.    人工膝関節置換術後の膝蓋大腿関節におけるpatella trackingと接触圧力についての実験的検討,整形外科バイオメカニクス,13 (1991)387-391,大森 豪・古賀良生・高橋栄明・笹川和彦・原利昭・Joan E. BechtoldRamon B. Gustilo

5.    PTB下腿装具の免荷性の評価,日本機械学会論文集(A編),58 (1992)1148-1153,笹川和彦・原利昭・石井卓・古賀良生・金谷喜久雄・田村義則

6.    感圧導電ゴムを用いた関節内接触圧力分布測定システム,日本機械学会論文集(A編),58 (1992)1154-1159,原利昭・笹川和彦・中部昇・古賀良生・金谷喜久雄

7.    股関節接触面圧の実験的解析−感圧導電ゴムセンサーを使用して−,日本臨床バイオメカニクス学会,14 (1992)315-318,元田英一・三浦隆行・岩崎洋史・笹川和彦・原利昭

8.    膝蓋大腿関節の接触圧力分布および膝蓋骨trackingの同時測定システム,日本臨床バイオメカニクス学会,14 (1992)319-323,今井和実・笹川和彦・原利昭・大森豪・高橋美徳・古賀良生

9.    膝蓋骨非置換人工膝関節置換術後の膝蓋大腿関節における接触動態についての実験的検討,日本臨床バイオメカニクス学会,14 (1992)325-329,大森豪・古賀良生・笹川和彦・原利昭・今井和実・Joan E. BechtoldRamon Gustilo

10. 脛骨結節前方移行術前後の膝蓋大腿関節の接触圧力および膝蓋骨trackingの変化,日本臨床バイオメカニクス学会,14 (1992)331-334,笹川和彦・今井和実・原利昭・大森豪・高橋美徳・古賀良生

11. 下肢アライメント変化による膝関節接触圧力への影響についての実験的検討,日本臨床バイオメカニクス学会,14 (1992)341-344,岩崎洋史・笹川和彦・原利昭・大森 豪・高橋美徳・古賀良生

12. 駆血帯装着時の接触圧力分布測定,日本臨床バイオメカニクス学会,14 (1992)453-456,船平伸之・笹川和彦・原利昭・佐藤朗・古賀良生

13. 膝蓋骨非置換TKAにおける膝蓋大腿関節の適合性についての検討,日本臨床バイオメカニクス学会誌,15 (1994)483-488,中部昇・今井和実・原利昭・笹川和彦・大森豪・古賀良生

14. THEORETICAL ANALYSIS OF ELECTROTHERMAL CRACK PROBLEM CONSIDERING THOMSON EFFECT, Mechanics and Materials for Electronic Packaging: Volume 3 - Coupled Field Behavior in Materials, 1994 International Mechanical Engineering Congress and Exposition, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, AMD-193 (1994)53-59, Masumi Saka, Kazuhiko Sasagawa, and Hiroyuki Abé

15. CURRENT DENSITY AND TEMPERATURE DISTRIBUTIONS NEAR THE CORNER OF ANGLED METAL LINE, Mechanics Research Communications, 22(5) (1995), 473-483, K. Sasagawa, M. Saka and H. Abé

16. THEORETICAL ANALYSIS OF A CRACK PROBLEM IN ELECTROTHERMAL FIELD, Application of Fracture Mechanics in Electronic Packaging and Materials, THE 1995 ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITIONTHE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-11/MD-64 (1995), 1-6, Kazuhiko Sasagawa, Masumi Saka and Hiroyuki Abé

17. Analysis of Electromigration in Angled Metal Line, Experimental/Numerical Mechanics in Electronic Packaging, SEM, 1 (1996), 108-116, K. Sasagawa, Y. Honma, M. Saka and H. Abé

18. Contact pressure and three-dimensional tracking of unresurfaced patella in total knee arthroplasty, The Knee, 4 (1997), 15-21, Go Omori, Yoshio Koga, Joan E. Bechtold, Ramon B. Gustilo, Noboru Nakabe, Kazuhiko Sasagawa, Toshiaki Hara, Hideaki E. Takahashi

19. EFFECT OF ROUNDNESS GIVEN TO CORNER OF ANGLED METAL LINE ON ELECTROMIGRATION FAILURE, Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK 97, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-19-1 (1997), 1177-1182, Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka and Hiroyuki Abé

20. Study on Electromigration Considering Singularity of Temperature Gradient at Corner, Experimental/Numerical Mechanics in Electronic Packaging, SEM, 2 (1997), 126-133, Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka and Hiroyuki Abé

21. Analysis of Electromigration Considering Thomson Effect, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, THE 1998 ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITIONTHE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-24 (1998), 87-92, K. Sasagawa, M. Yagi, M. Saka and H. Abé

22. A New Approach to Calculate Atomic Flux Divergence by Electromigration, Transactions of the ASME, Journal of Electronic Packaging, 120(1998), 360-366, K. Sasagawa N. Nakamura M. Saka H. Abé

23. 金属薄膜配線におけるエレクトロマイグレーション損傷支配パラメータの実験的検証,日本機械学会論文集(A編)65 (631), (1999-3), 469-476,笹川和彦, 中村直章, 坂真澄, 阿部博之

24. Verification of a Governing Parameter for Electromigration Damage in Bamboo Lines, Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK 99, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-16-1 (1999), 227-232, Kazuhiko Sasagawa, Kazushi Naito, Masataka Hasegawa, Masumi Saka and Hiroyuki Abé

25. Prediction of Electromigration Failure in Bamboo Lines, Advances in Electronic Packaging, PROCEEDINGS OF THE PACIFIC RIM/ ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE INTERPACK 99, THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS, EEP-16-1 (1999), 233 - 238, Kazuhiko Sasagawa, Kazushi Naito, Masumi Saka and Hiroyuki Abé

26. A Method to Predict Electromigration Failure of Metal Lines [Journal of Applied Physics, 86 (11), (1999-12), 6043 - 6051] K. Sasagawa, K. Naito, M. Saka and H. Abé

27. Atomic Flux Divergence in Bamboo Line for Predicting Initial Formation of Voids and Hillocks [Theoretical and Applied Fracture Mechanics, 33 (1), (2000-2), 67 - 72] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

28. Experimental Verification of Prediction Method for Electromigration Failure of Polycrystalline Lines [Journal of Applied Physics, 87 (6), (2000-3-15), 2785 - 2791] K. Sasagawa, K. Naito, H. Kimura, M. Saka and H. Abé

29. Verification of the Governing Parameter for Electromigration Damage in Passivated Polycrystalline Line [Proc. of InterPACK '01, The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, ASME, Kauai, Hawaii, USA, July 8-13, 2001, (2001-7-9), IPACK2001-15644, 1-9] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

30. Effects of Corner Position and Operating Condition on Electromigration Failure in Angled Bamboo Lines without Passivation Layer [Thin Solid Films, 401(1-2), (2001-12-17), 255 - 266] K. Sasagawa, M. Hasegawa, K. Naito, M. Saka and H. Abé

31. Governing Parameter for Electromigration Damage in the Polycrystalline Line Covered with Passivation Layer [Journal of Applied Physics, 91(4), (2002-2-15), 1882-1890] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

32. Prediction of Electromigration Failure in Passivated Polycrystalline Line [Journal of Applied Physics, 91(11), (2002-6-1), 9005-9014] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

33. Simulation of Electromigration Failure in Angled Polycrystalline Line Covered with Passivation Layer [Advances in Computational Engineering & Sciences, Proc. 2002 International Conference for Computational Engineering and Sciences(CD-ROM), (2002-7/31-8/2, Reno), paper-ID 86]  M. Hasegawa, K. Sasagawa, M. Saka and H. Abé

34. Derivation of Film Characteristics and Prediction of Electromigration Failure in Passivated Polycrystalline Line [Advanced Metallization Conference 2002, (2002-10/28-30), MRS, 291-296] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

35. Failure Simulation of Angled Polycrystalline Lines Covered with Passivation Layer [Proc. 2002 ASME International Mechanical Engineering Congress & Exposition (CD-ROM), ASME, Nov. 17-22, 2002, New Orleans, USA, paper-ID IMECE2002-39677] M. Hasegawa, K. Sasagawa, M. Saka and H. Abé

36. Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends [Proc. of InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, July 6-11, 2003, (2003-7-6), InterPack2003-35064] M. Hasegawa, K. Sasagawa, M. Saka and H. Abé

37. Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness  [Proc. of InterPACK '03(CD-ROM), The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, ASME, Maui, Hawaii, USA, July 6-11, 2003, (2003-7-6), InterPack2003-35065] K. Sasagawa, M. Hasegawa, N. Yoshida, M. Saka and H. Abé

38. Derivation of Film Characteristic Constants by Using Governing Parameter for Electromigration Damage in Passivated Bamboo Line [Proceedings of 11th International Conference on Fracture (CD-ROM), March 20-25, 2005, Turin, Italy, Paper ID 3699] M. Hasegawa, K. Sasagawa and M. Saka

39. Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines [Proceedings of IPACK2005(CD-ROM), The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, ASME, July 17-22, 2005, San Francisco, California, USA, Paper ID IPACK2005-73133] K. Sasagawa, S. Uno, N. Yamaji and M. Saka

40. Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line [Key Engineering Materials, Vol. 297-300(Advances in Fracture and Strength), Proc. Asian Pacific Conference for Fracture and Strength ’04, Lotte Hotel Jeju, Korea (2004-10/6-8), Nov. 2005, 263-268] S. Uno, M. Hasegawa, K. Sasagawa and M. Saka

41. Electromigration Failure of Metal Lines [International Journal of Fracture, Volume 138, Numbers 1-4, March 2006, 219-240] H. Abé, K. Sasagawa and M. Saka

42. Evaluation of Threshold Current Density of Electromigration Damage in Angled Bamboo Lines [Proceedings of ASME 2007 InterPACK Conference(CD-ROM), The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, ASME, July 8-12, 2007, Vancouver, British Columbia, CANADA, Paper ID IPACK2007-33237] K. Sasagawa and S. Fukushi

43. 高位脛骨骨切り術前後における膝蓋大腿関節の接触圧力分布測定 [日本臨床バイオメカニクス学会誌, Vol.28 (2007/11/20), 173-177]  成田純平,笹川和彦,塚田晴彦,石橋恭之

44. リンパ浮腫治療用弾性ストッキングと下肢間の接触圧力分布測定システム[日本臨床バイオメカニクス学会誌, Vol.28 (2007/11/20), 433-437]  矢島久幸,笹川和彦,細川賀乃子,近藤和泉

45. Threshold Current Density of Electromigration Damage in Angled Polycrystalline Line [Key Engineering Materials Vols. 353-358 (2007, Nov.) pp. 2958-2961] K. Sasagawa, N. Yamaji and S. Fukushi

46. Formation of Metallic Micro/Nanomaterials by Utilizing Migration Phenomena and Techniques for Their Applications [Materials Science Forum, Vol. 614, (Mar., 2009), 3-9] M. Saka, H. Tohmyoh, M. Muraoka, Y. Ju, and K. Sasagawa

47. Derivation of Electromigration Characteristic Constants of Metal Line Used in Electronic Devices [Proc. 12th Int. Conf. Fracture, July 12-17, 2009, Ottawa, Canada (CD-ROM), (July, 2009), Paper No. T22.009. (total 9 pages)] K. Sasagawa, T. Gomyo, and A. Kirita

48. Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree [Proc. ASME 2009 InterPACK Conf., July 19-23, 2009, San Francisco, California, USA (CD-ROM), (2009), Paper No. IPACK2009-89229 (total 6 pages)] K. Sasagawa, A. Kirita, T. Abo, and A.H. Hassan

49. 嚥下時の口腔および咽頭内の接触圧力同時測定システムの開発, 臨床バイオメカニクス, Vol.30, (2009年9月20日),83-87]  大里泰彦,笹川和彦,横山紘太郎,才藤栄一,近藤和泉

50. ステント形状評価を目的とした血管―ステント間の接触圧力分布測定システム, 臨床バイオメカニクス, Vol.30, (2009年9月20日),249-253]  笹川和彦,横山紘太郎,成田純平

51. Derivation of Film Characteristic Constants of Polycrystalline Line for Reliability Evaluation against Electromigration Failure [Mechanics of Materials, 41(10) , (Oct., 2009), 1090-1095] M. Hasegawa, K. Sasagawa, S. Uno, M. Saka and H. Abé

52. A Numerical Simulation of Nanostructure Formation Utilizing Electromigration [J. Electron. Mater., 38(10), (Nov., 2009), 2201-2206] K. Sasagawa, S. Fukushi, Y. Sun, and M. Saka

53. Simulation of Nanostructure Production by Electromigration Considering Specimen's Shape [J. Nanosci. Nanotechnol., 10(9), (2010-9), 6036-6040] K. Sasagawa, A. Kirita, S. Fukushi and M. Saka

54. Development of Sensor System for Measurement of Distributions of Contact Pressure and Shear Stress on Contacting Skin Surface [The 5th International Symposium on Advance and Technology in Experimental Mechanics(CD-ROM), Kyoto/Ryukoku University, (2010-11/4~7), Paper ID: 127] K. Sasagawa, K. Tokiyoshi

55. Development of Simulation of Nanostructure Production due to Electromigration Considering Specimen’s Damage [Proc. the 4th JSME/ASME International Conference on Materials and Processing(CD-ROM), Corvallis, Oregon, USA, (2011-6/13~17), Papar ID: ICMP2011-51113] K.Sasagawa, T. Abo and J. Unuma

56. Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes under High Current Density [Proc. ASME 2011 InterPACK Conf.(CD-ROM), Portland, Oregon, USA, (2011-7/6~8), Paper ID: InterPACK2011-52169] K.Sasagawa, J. Unuma and T. Abo

57. 内視鏡手術への応用を目的とした高空間分解能接触圧力センサシステムの開発 [臨床バイオメカニクス, Vol.32, (2011-10/25), 185-190] 笹川和彦, 石川諒, 横山紘太郎, 大里泰彦

58. 生体への適用を目的とした接触圧力およびせん断応力の同時測定センサの開発 [臨床バイオメカニクス, Vol.32, (2011-10/25), 309-313]  時吉康太, 笹川和彦

59. A Comparison of Electromigration Failure of Metal Lines with Fracture Mechanics [Acta Mech. Sin. 28(3), (2012-8):774–781] H. Abé, M. Muraoka, K. Sasagawa and M. Saka

60. Numerical Modeling of Electromigration Damage in Multilevel Interconnection with Reservoir Structure for Evaluation of Allowable Electric Current [Proceedings of the 7th International Symposium on Advanced Science and Technology in Experimental Mechanics, Taipei/The Grand Hotel, Taiwan, (2012-11/8-11), Paper ID: G101] K. Sasagawa, T. Yanagi and J. Unuma

61. Numerical Study of Allowable Current Density for Electromigration Damage of Multilevel Interconnection in Integrated Circuit [Proceedings of 13th International Conference on Fracture (CD-ROM), Paper ID: S30-008, 8 pages, (2013/6/19, China National Convention Center, Beijing, China)] K. Sasagawa, K. Fujisaki, T. Yanagi

62. Novel motion preservation device for atlantoaxial instability [J. Spinal Disorders & Techniques, 26(3), (May 2013), pp. E107-111] Kato, Kozo; Yokoyama, Toru; Ono, Atsushi; Numasawa, Takuya; Wada, Kanichiro; Tonosaki, Yoshikazu; Osato, Yasuhiko; Sasagawa, Kazuhiko; Toh, Satoshi

63. Development of Contact-Pressure and Shear-Stress Sensing System for Application to a Haptic Display [J. JSEM, Vol.13, (July 2013), pp. s228-s232, 2013] K. Sasagawa, T. Oyama, K. Tokiyoshi, K. Yokoyama

64. 人工股関節置換術におけるカップ固定性評価を目指した接触圧力分布測定システムの開発 [臨床バイオメカニクス, Vol.34, (Nov. 2013), pp.129-134] 塚原 , 笹川和彦, 西井

65. Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices under High Current Density [ASME J. Electronic Packaging, Vol. 136, No. 4,Dec. 2014, 041011-1-5] K. Sasagawa, K. Fujisaki, J. Unuma, R. Azuma

66. ラットアキレス腱の引張試験による弾性率評価 [臨床バイオメカニクス, Vol. 35, pp. 303-307, (2014)] 小山拓馬, 藤崎和弘, 笹川和彦, 飯尾浩平, 津田英一, 山本祐司, 石橋恭之

67. Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure with Reservoir [Proceedings of ASME InterPACKICNMM2015, Paper No. IPACK2015-48744, pp. V002T02A015; 5 pagesdoi:10.1115/IPACK2015-4874420150706-9, San Francisco, USA] K. Fujisaki, H. Narita, K. Sasagawa

68. Evaluation of (Bi0.4Sr0.6)xCo0.3Fe0.7O3−δ (x = 0.7, 0.8, 0.9, 1.0, 1.1) perovskite-type oxide as potential cathode for intermediate-temperature solid oxide fuel cells [International Journal of Hydrogen Energy, Volume 40, Issue 34, 14 September 2015, Pages 11011–11021, doi:10.1016/j.ijhydene.2015.05.195] Deni S. Khaerudini, Guoqing Guan, Peng Zhanga, Xiaogang Hao, Zhongde Wang, Yutaka Kasai, Kazuhiko Sasagawa, Abuliti Abudula

 

U.著書

1.    機械工学便覧 [基礎編α3材料力学(2005-4-25),分担執筆13・14,199 – 200,日本機械学会,丸善] 笹川和彦ほか (全86名)

2.    よくわかる実験技術・学術用語 [(2006-11-1),分担執筆 よくわかる学術用語 エレクトロマイグレーション,ISBN4-9903400-0-0, 91 – 92,横山 隆,松井剛一,井口 学編集,日本実験力学会,全123] 笹川和彦ほか (全35名)

3.    金属微細配線におけるマイグレーションのメカニズムと対策 [(2006-12-25),分担執筆 第12章エレクトロマイグレーションの損傷予測モデリング,ISBN4-903413-15-2, 151 – 174新宮原 正三 監修,サイエンス&テクノロジー,全206] 笹川和彦ほか (全15名)

4.    Metallic Micro and Nano Materials - Fabrication with Atomic Diffusion [Engineering Materials, M. Saka (Ed.), Springer, (2011) , ISBN978-3-642-15410-2] M. Saka, K. Sasagawa, M. Muraoka, H. Tohmyoh and Y. Ju (Authors),

 

V.解説記事

1.    力センサーを使用した側弯矯正装具のチェックシステム,日本義肢装具学会誌,8 (1992), 35-37,田村義則・赤川喜一・古賀良生・新井久夫・高橋一雄・原利昭・笹川和彦・中部昇

2.    感圧導電ゴムセンサとその応用−下腿装具の機能評価−,センサ技術,12 (1992)62-67,原利昭・笹川和彦・古賀良生

3.    LSI断線シミュレーション 弘前大がソフト開発,日刊工業新聞,521(1999)7

4.    Software for Simulation of Line Failure of LSI DevicesNew Technology JapanJETRO27(6)1999-933

5.    半導体の損傷予測ソフト開発,東奥日報,1120(2001)16

6.    エレクトロマイグレーション,日本実験力学会誌「実験力学」,3(4), (2003-12)71-72,笹川和彦

7.    米機械学会で最優秀 半導体の損傷・寿命を予測,東奥日報,920(2007),夕刊3

8.    生体に作用する応力計測, 非破壊検査, Vol.62, pp. 515-521, 2013.10 笹川和彦, 藤ア和弘

 

W.招待講演・講義

1.     Theoretical Analysis of a Crack Problem in Electrothermal Field, The 1995 ASME International Mechanical Engineering Congress and Exposition, Symposium on Application of Fracture Mechanics in Electronic Packaging and Materials, Nov. 12-17, 1995, San Francisco, USA

2.     折れ曲がる金属薄膜配線におけるエレクトロマイグレーション,日本機械学会RC-144エレクトロニック・パッケージングにおけるマイクロ接合の信頼性評価に関する研究分科会,1997919日(グランドヒル市ヶ谷)東京

3.     折れ曲がる金属薄膜配線におけるエレクトロマイグレーション,日本機械学会P-SC275電子デバイスの材料力学的問題に関する調査研究分科会,1997925日(東工大精研)

4.     電子パッケージ金属薄膜配線におけるエレクトロマイグレーション損傷支配パラメータの特定と損傷予測,日本機械学会材料力学部門実験力学先端技術研究会,1998930日(宮城県工技センター)

5.     電子デバイス用配線の強度評価、電子パッケージの熱的劣化に関する力学的・物性的総合研究−九州大学応用力学研究所研究集会, 九州大学(福岡春日市)(1999-12-7,8)

6.     LSI配線における断線予測シミュレーション、日本金属学会「微細材料の力学特性と信頼性」シンポジウム,東京大学(東京), (2000-1-13)

7.     Electromigration Damage in Bamboo Line, International Conference of Role of Mechanics for Development of Science and Technology, Mesomechanics 2000, June 13-16, 2000, 6/16  Xi’an, China

8.     "Prediction of Metal Line Failure by Using a Governing Parameter of Electromigration Damage", Chonbuk National University/Nationally Accredited High-Tech Engineering Center, Chonju, Korea, Director/Prof. Sung-Mo Yang, 200/8/28

9.     "Prediction of Metal Line Failure by Using a Governing Parameter of Electromigration Damage” Kyungpook National University, Taegu, Korea, Prof. Seock-Sam Kim, 2000/8/29 

10.  金属薄膜配線のエレクトロマイグレーション,エレクトロマイグレーションによるボイド・ヒロック形成の観察,公開講座「材料物理工学セミナー」―機械材料の高性能・多機能化のための材料界面の設計と制御―,東北大学工学部,20009, 27

11.  金属薄膜配線のエレクトロマイグレーション,エレクトロマイグレーションによるボイド・ヒロック形成の観察,東北大学大学院工学研究科機械・知能系学際基盤科目「材料物理工学特論」,東北大学工学部,20009, 27

12.  電子デバイス信頼性確保のための微細配線断線故障の実用的予測・防止法の開発,青森県産学連携推進会議,弘前大学,2001-11-20

13.  保護膜で被覆された多結晶配線のエレクトロマイグレーション損傷支配パラメータとそれを用いた断線予測法,第4ASET(技術研究組合超先端電子技術開発機構)配線技術研究会 −シミュレーションと物性−,ASET本部(東京),2002228

14.  金属薄膜配線の信頼性試験・評価(4.1配線損傷と寿命予測,4.2数値シミュレーションによる高精度信頼性評価T,4.3数値シミュレーションによる高精度信頼性評価U,3回分),東北大学大学院工学研究科,ISTU,電子パッケージコース パッケージ性能試験・評価,2002,10

15.  医療・福祉の生体力学的研究の2,3例,あおもり健康福祉機器開発協議会フォーラム「健康・医療・福祉産業への取り組み」,弘前商工会議所,2002-9-3

16.  半導体集積回路配線の断線故障予測,日本材料学会破壊力学部門委員会,仙台市戦災復興記念館(仙台),2002−11−15

17.  電子デバイス信頼性確保のための微細配線の断線故障予測法の開発,秋田県内の工学系研究機関による研究紹介 東北地方の高専・大学の研究紹介と交流会 (秋田編),秋田大学ベンチャー・ビジネス・ラボラトリー(秋田市),2003117

18.  デバイス配線のエレクトロマイクレーション損傷と高精度信頼性評価,日本テクノセンター・セミナー,日本テクノセンター(東京),2004−11−4

19.  集積回路の配線損傷メカニズムとエレクトロマイグレーション,(株)ルネサス北日本セミコンダクタ 津軽工場(五所川原市),2005527

20.  科研費申請書の作成 理工学部笹川和彦の場合,平成17年度弘前大学科学研究費補助金説明会,弘前大(弘前市),平成17(2005)年10月6日

21.  薄膜配線のエレクトロ・マイグレーション損傷 ―半導体集積回路における配線損傷メカニズムと信頼性評価を中心に―,新光電気工業株式会社(長野市),2005/11/25

22.  微細電子デバイス配線の電流による疲労損傷と信頼性評価法,日本材料学会東北支部特別講演会・総会,東北大学青葉記念会館(仙台),2006−3−11

23.  エレクトロマイグレーション損傷と数値シミュレーションによる信頼性評価法,日本材料学会X線材料強度部門委員会第43回X線材料強度に関する討論会,東京都大田区産業プラザ(東京),2006−12−1

24.  電子デバイス配線のエレクトロマイグレーション損傷と高精度信頼性評価,TH企画セミナーセンター・セミナー,総評会館(東京),2007−5−16

25.  生体の接触圧力測定システムの開発と応用 ーリハビリテーション領域への応用を中心にー,第60回藤田保健衛生大学リハビリテーション部門研修会(藤田リハビリテーション医学・運動学研究会),藤田保健衛生大学衛生学部(愛知県豊明市),2007−7−23

26.  金属薄膜配線におけるエレクトロマイグレーション損傷のしきい電流密度評価,日本材料学会第124回破壊力学部門委員会,ハーネル仙台(仙台),2007−8−6

27.  生体に作用する接触圧力の測定システムの開発と応用,次世代センサ協議会東北支部講演会「MEMSセンサの開発動向と応用 2007/11/14 弘前大学

28.  医用および微小材料システムの評価法の開発研究,若手研究者&院生のためのキャリアアップ講演会,2007/12/26,新潟大学VBL(新潟)

29.  科研費申請書の作成,八戸高専科研費申請書作成講習会,八戸高専(八戸),2009−10−13

30.  「電子デバイスと生体の材料システムを評価する」,平成22年度化学系学協会東北大会,2010/9/26,岩手大学(盛岡)

31.  「生体の接触圧力分布の測定」,日本生体医工学会第2回次世代内視鏡技術研究会,平成221113日,弘前大学(弘前)

32.  「生体内の荷重伝達解明に基づく力学的な病因特定と治療・診断法の開発」,第67回グローバルCOE「ナノ医工学シリーズセミナー」(2007年度採択グローバルCOEプログラム 新世紀世界の成長焦点に築くナノ医工学拠点),2012/1/26,東北大学医工学研究科(仙台)

33.  「材料システムとしての電子機器安全性と生体機能性の評価」2013/3/25平成24年度日本材料学会東北支部総会・材料フォーラム講演会,特別講演,カレッジプラザ(秋田市)

34.  「微細電子配線の安全性評価と生体の応力評価」,2013/4/26日本非破壊検査協会 東北支部「支部会・講演会」 特別講演,青年文化センター(仙台市)

 

 

X.参考論文(アブストラクト査読国際会議プロシーディングほか)

1.    The Load-Bearing Functional Evaluation of PTB Orthosis, Proceedings Third U.S.A.-China-Japan Conference On Biomechanics, (1991), 74-75, T. Hara, K. Sasagawa, Y. Koga, H. Takahashi

2.    CONTACT PRESSURE DISTRIBUTION ON THE PATELLO-FEMORAL JOINT BEFORE AND AFTER TOTAL KNEE ARTHROPLASTY, TRANSACTIONS of the 38th Annual Meeting Orthopaedic Research Society, 17 (1992), 332, G. Ohmori, K. Sasagawa, J.E. Bechtold, P.T. Bianco, R.B. Gustilo, T. Hara, H. Takahashi, Y. Koga

3.    Radial Styloid Wedge Osteotomy for Early SLAC Wrist, Nonunion of the Scaphoid and for Painful Radial Styloid Impingement Syndrome: A Preliminary Report Wrist Disorders, Springer-Verlag, Tokyo, (1992), 299-307, MINORU SHIBATA, HIDEHIKO SAITO, JUNICHI HASEGAWA, TOSHIAKI HARA, KAZUHIKO SASAGAWA and NOBORU NAKABE

4.    Numerical Simulation of Electromigration in Angled Metal Line, Proceedings of the International Symposium on Microsystems, Intelligent Materials and Robots, (1995), 213-216, Kazuhiko Sasagawa, Takanori Yamauchi, Masumi Saka and Hiroyuki Abé

5.    Verification of a Governing Parameter for Electromigration Damage in Metal Lines, Proceedings of 1999 IEMT/IMC Symposium, (1999), 304-309, K. Sasagawa N. Nakamura M. Saka H. Abé

6.    Electromigration Damage in Bamboo Line [Proc. of an Int. Conf.  of Mechanics for Development of Science and Technology, June 2000, Xi'an, Vol.II, 847-852]  K.Sasagawa, M. Hasegawa, M. Saka, H. Abé

7.    Prediction of Bamboo Line Failure by Using a Governing Parameter of Electromigration Damage [Proc. of Int. Workshop on Sensing and Evaluation of Materials System, Sendai, Japan, 22 Aug., 2000, Eds. M. Saka, H. Soyama, (2000-8), 25-32] K. Sasagawa, K. Naito, M. Hasegawa, M. Saka and H. Abé

8.    A Governing Parameter for Electromigration Damage and Prediction of Failure in Al Lines [Proc. of Int. Symposia on Material Science for the 21st Century, Osaka, Japan, 21-26 May., 2001, (2001-5-21), 245-248] K. Sasagawa, K. Naito, M. Hasegawa, M. Saka and H. Abé

9.    A Governing Parameter for Electromigration Damage in Passivated Polycrystalline Lines and Its Verification [Proc. Sixth International Workshop on Stress-Induced Phenomena in Metallization, AIP, Cornell Univ., Ithaka, USA, July 25-27, 2001, (2001-7)] K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

10. Prediction Method of Electromigration Failure in Passivated Polycrystalline Line [Proc. International Symposium of Precision Engineering and MEMS 2002, Nov. 3-6, 2002, Hangzhou, China, 14 - 20]  K. Sasagawa, M. Hasegawa, M. Saka and H. Abé

11. Evaluation Method of the Threshold Current Density for Electromigration Damage in IC Metal Lines [The Second Japan-Taiwan Workshop on Mechanical and Aerospace Engineering, Tokyo Institute of Technology & Tohoku University (2003-10/17-20), 129 - 137] M. Hasegawa, K. Sasagawa and M. Saka

12. Derivation of the Film Characteristic Constants Using the Governing Parameter for Electromigration Damage at Metal Line Ends, Proc. of ISMME2003, The International Symposium on Micro-Mechanical Engineering―Heat Transfer, Fluid Dynamics, Reliability and Mechatronics―, JSME, Tsuchiura, Japan, December 1-3, 2003, (2003-12-1), 433 – 439, M. Hasegawa, K. Sasagawa, S. Uno and M. Saka

13. Derivation of Film Characteristic Constants of Polycrystalline Line for Reliability Evaluation against Electromigration Failure [2004 ASME International Mechanical Engineering Congress & Exposition, ASME, Nov. 13-19, 2004, Anaheim, USA, paper ID IMECE2002-60620 (presentation only)] M. Hasegawa, K. Sasagawa, S. Uno, M. Saka and H. Abé

14. Dynamic Measurement of Pressure Distribution of Bi-ski Seat Interface [Journal of Biomechanics Vol. 39/S1(2006), Abstracts of the 5th World Congress of Biomechanics, Munich, Germany(2006-7/29-8/4),S553] H. Yajima and K. Sasagawa

15. Development of Measurement System of Contact Pressure Distribution in Human Small Joint [Journal of Biomechanics Vol. 39/S1(2006), Abstracts of the 5th World Congress of Biomechanics, Munich, Germany(2006-7/29-8/4),S81] J. Narita, K. Sasagawa, H. Miyata and S. Toh

16. Change of Contact Pressure Distribution in Patellofemoral Joint with High Tibial Osteotomy [Transactions of the 53th Annual Meeting of Orthopaedic Research Society (CD-ROM), San Diego, USA (2007-2/11-14) Paper No: 0748] J. Narita, K. Sasagawa, H. Tsukada and Y. Ishibashi

17. Evaluation of Threshold Current Density of Electromigration Damage in Interconnect Tree with Angled Cu Lines [12th International Conference on Electronics Materials and Packaging(CD-ROM), Singapore, Republic of Singapore, (2010-10/25~27), Papar ID: 110-116] K. Sasagawa, T. Abo

18. Change in Damage Mechanism of MWCNTs under Electric Current with Oxygen Concentration [13th International Conference on Electric Materials and Packaging(USB frash drive), Kyoto, Kyoto Garden Palace, Japan, (2011-12/12~15), 69-72] K. Sasagawa and J. Unuma

19. Development of Numerical Simulation of Electromigration Damage in Cu Multilevel Interconnection with Reservoir Structure [Abstracts of the 12th International Workshop on Stress-Induced Phenomena in Microelectronics, Kyoto/Co-op Inn Kyoto, Japan, (2012-5/28-30), 31-32] K. Sasagawa and T. Yanagi

20. Evaluation of Threshold Current Density in Interconnect with Reservoir Structure Using Numerical Modeling of Electromigration Damage [Extended Abstracts of the 2012 International Conference on Solid State Devices and Materials, Kyoto/Kyoto International Conference Center, Japan, (2012-9/25-27), 56-57] K. Sasagawa and T. Yanagi

21. Development of Shear Stress Sensing System for Application to a Haptic Display [Proceedings of the 7th International Symposium on Advanced Science and Technology in Experimental Mechanics, Taipei/The Grand Hotel, Taiwan, (2012-11/8-11), Paper ID: M117] K. Sasagawa, T. Oyama, K. Tokiyoshi and K. Yokoyama

22. Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-component of Electronic Devices under High Current Density [Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (CD-ROM), Paper ID:IPACK2013-73130, 5 pages, (2013/7/18, Hyatt Regency San Francisco Airport, San Francisco, USA)] K. Sasagawa, K. Fujisaki, J. Unuma, R. Azuma

23. Measurement System of Contact Pressure Distribution between Soft Tissues of the Oral Cavity and Pharynx [Proceedings of APCB2013, 2013.8.29-31, Seoul/Korea] K. Sasagawa, S. Tsukahara, Y. Osato, K. Fujisaki

24. Development of Tactile Sensing System for Haptic Interface [Proceedings of Int. Symp. on IREMD, pp. 73-75, 2013.9.12-13, Hirosaki/Japan] T. Oyama, K. Sasagawa, K. Fujisaki

25. Measurement System of Contact Pressure Distribution in Oral Cavity during Swallowing and Articulation [Proceedings of Int. Symp. on IREMD, pp. 107-110, 2013.9.12-13, Hirosaki/Japan] T. Satoshi, K. Sasagawa, R. Ishikawa, K. Fujisaki

26. Integration of Flexible and Thin Sensor System of Contact Pressure and Shear-stress for Application to Haptic Display [The 7th World Congress of Biomechanics, Boston, USA, 20140706~11 Poster] Shunsuke Sato, Takuma Oyama, Kazuhiro Fujisaki, Kazuhiko Sasagawa

27. Effect of Demineralization on Impact Fracture Characteristics of Bovine Cortical Bone Tissue [The 7th World Congress of Biomechanics, Boston, USA, 20140706~11 Poster] Kazuhiro Fujisaki, Hiroya Yokoyama, Ayumi Hasegawa, Kazuhiko Sasagawa

28. Damage Observation of CNT Networked Structure under High Current Density [InterPACKICNMM2015 (ASME)San Francisco, USA 20150706-9          20150706] K. Fujisaki, K. Sasagawa, D. Narita

29. Evaluation of Allowable Current Density for Electromigration Damage in Via-connected Interconnect [17th Electronic Materials and Packaging Conference, (EMAP2015)4pages Portland, USA20150901-4  20150902] K. Fujisaki, K. Sasagawa, H. Narita

30. Measurements of Contact Pressure and Shear Stress on the Sole of Foot by Using Thin and Flexible Sensor [The 8th Asian-Pacific Conference on Biomechanicsp. 32020150916-19  20150918Sapporo] Satoshi Ogawa, Noritugu Kikuhara, Kazuhiro Fujisaki, Kazuhiko Sasagawa

31. Prediction of Deformation Damages of Tree Branches Based on Bending Analysis and Bioelectric Response Measurements [The 8th Asian-Pacific Conference on Biomechanicsp. 35720150916-19 20150918Sapporo] Kuniaki Sato, Yukihiro Yamada, Kazuhiro Fujisaki, Kazuhiko Sasagawa

32. Improvement of Impact Toughness of Cortical Bone by Means of Local Demineralization of Defect Area on Structure [The 8th Asian-Pacific Conference on Biomechanicsp. 30320150916-19 20150918Sapporo] Ayumi Hasegawa, Kazuhiro Fujisaki, Kazuhiko Sasagawa

33. Damage of CNT Network Structure under Accelerated Condition [Abstract book ATEM'15p. 211, International Conference on Advanced Technology in Experimental Mechanics 2015 (ATEM’15) and The 14th Asian Conference on Experimental Mechanics (ACEM14) Toyohashi, Japan20151004-8 20151005] Shunsuke Sato, Kazuhiro Fujisaki, Kazuhiko Sasagawa, Takuya Katabira

 

 

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